What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Nanoelectronics deal with extremely small electronic components — transistors, sensors and circuits that can fit on the tip of a needle. This technology powers our everyday lives through devices such ...

Seoul National University's College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...

Synopsys continues to work with TSMC to expand multiphysics analysis flows for larger designs with hierarchical analysis methodology. The multiphysics flow includes Ansys RedHawk-SC, Ansys RedHawk-SC ...

Developing economies do not have to invest billions of dollars in state-of-the-art fabs to get into the semiconductor industry, according to Sadeg Faris, chairman and chief executive officer of Reveo ...

SUNNYVALE, Calif., Sept. 24, 2025 /PRNewswire/ -- Synopsys, Inc. (SNPS), (NASDAQ: SNPS) today announced TSMC has certified the Ansys portfolio of simulation and analysis solutions, enabling accurate ...