Nasdaq

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...
Business Wire

Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today entered the fast-growing system analysis and design market with the announcement of the Cadence ® Clarity ™ 3D ...
VentureBeat

TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.
Hosted on MSN

Cadence and TSMC Strengthen Partnership to Enhance AI & 3D-IC Designs

Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”), aimed at accelerating time to silicon for ...
Seeking Alpha

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...
Seeking Alpha

Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry

Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P process node SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) ...
New Electronics

Cadence unveils 'breakthrough' Integrity 3D-IC Platform

Cadence has released the Integrity 3D-IC platform, the industry’s first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation and system analysis in a single, ...
Yahoo

ITRI Tapes Out 3D-IC Chip Using Cadence Technology

SAN JOSE, CA--(Marketwire - Oct 15, 2012) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that its full suite of 3D-IC technologies were ...
Morningstar

Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric

Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate ...
Electronic Design

Cadence Sigrity 2018 integrates 3D design and 3D analysis

San Jose, CA. Cadence Design Systems Inc. has announced its Cadence Sigrity 2018 release, which includes new 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing ...
EDN

Cadence announces results of collaboration on 3D ICs

3D ICs have been in the news a lot recently, and it is sometimes difficult to separate the wheat from the chaff. Cadence hopes that they can make reality a little clearer by telling us today about the ...