The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Theory of elasticity: elastic stability, principal of minimum potential energy, Raylegh-Ritz methods. Introduction to finite element methods of stress analysis: computer implementation and use of ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

A few guidelines show how to correctly use FEA stresses to find reasonable margins of safety. Although finite-element analysis has become an indispensable part of engineering, a few users knock it ...