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Tech Xplore on MSN3D chip stacking method created to overcome traditional semiconductor limitationsA novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...
Good morning, tech fam; here are some quick tech updates for you to catch up on! What’s New Today: MIT’s 3D chip breakthrough uses GaN transistors on silicon, e ...
AMD has inadvertently confirmed upcoming entry-level Ryzen 5 9600X3D CPU, a new gaming-optimized chip featuring its 3D ...
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Tom's Hardware on MSNAMD leaks new entry-level Ryzen 5 9600X3D CPU — new gaming-optimized 3D V-Cache chip expected before the end of the yearAMD has confirmed the existence of several upcoming processors, including a new entry-level Ryzen 5 9600X3D desktop CPU ...
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Tech Xplore on MSNTiny gallium nitride transistors boost chip speed and efficiency in new 3D designThe advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication ...
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Redmi K80 Ultra teased with Dimensity 9400+, D2 GPU, IceLoop cooling, and 3.24M AnTuTu score, setting a new benchmark record.
AMD's X3D series is red-hot for PC gamers, but the latest CPUs aren't exactly affordable. A 6-core variant is on the way, ...
The Ryzen 5 9600X3D not yet listed in AMD's database, but it is as close to official as it can get without a formal ...
Vivo Y400 Pro 5G with MediaTek Dimensity 7300 chipset has been launched in India: Check price, display, camera and more ...
A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture ...
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