Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

Abstract: A wideband, series-fed, single-layer, dual-circularly polarized (dual-CP) antenna based on proximity coupling is presented. The proposed antenna is formed by a cross-shaped corner-truncated ...

From reproductive rights to climate change to Big Tech, The Independent is on the ground when the story is developing. Whether it's investigating the financials of Elon Musk's pro-Trump PAC or ...

Welcome to the future, where the vibes are bad in almost every meaningful respect — but where you do, at the very least, get to “vibe code,” or use an AI model to write code and even build entire ...

Writing a college admissions essay is hard. But using AI could backfire badly. Credit: Ian Moore / Mashable Composite; Tero Vesalainen / iStock / Getty Every fall, high school students applying to ...