Ideal Applications Include: 1. High-power GPUs, CPUs, and ASICs in the 700–1200W range 2. 1U and 2U AI/HPC data center servers 3. Edge computing modules and distributed processing systems 4.

New Air-Based Cooling Module Makes Impossible Possible by Redefining Thermal Limits Previously Thought Achievable Only by Liquid Cooling. LOS ...

Infineon Technologies released a reference design using the company’s TDM22545D dual-phase OptiMOS power module to address AI server demands. The 10- × 9- × 5-mm power module co-packages two ...

Nvidia's GTC 2024 has confirmed the architecture of AI GPU. However, the demand for water cooling is increasing along with the growth of computing power. Where 1,000 watts were deemed as the ...

Mitsubishi Electric, which commercialized SiC power modules equipped with SiC-MOSFETs and SiC-SBDs in 2010, has adopted SiC power semiconductors for a variety of inverter systems, including air ...