SHENZHEN, China, Dec. 4, 2025 /PRNewswire/ -- MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, developed a quantum-driven 3D intelligent model, which ...

As it does so, a 3D printer system prints a rigid back structure to the blanket array membrane. As it does so, the hard UV radiation of space rapidly cures the resin, making it hard. This means a ...

Social media companies and their respective algorithms have repeatedly been accused of fueling political polarization by promoting divisive content on their platforms. Now, two U.S. Senators have ...

Soon, researchers may be able to create movies of their favorite protein or virus better and faster than ever before. Researchers at the Department of Energy's SLAC National Accelerator Laboratory ...

The vertical design and smart tracking functions of the towers offer big improvements over flat panel arrays. Currently, most solar farms consist of flat panels laid out across the ground or on ...

SAN FRANCISCO, Oct 24 (Reuters) - IBM (IBM.N), opens new tab said on Friday it can run a key quantum computing error correction algorithm on commonly available chips ...

Researchers built a chip-sized processor and 3D-printed copper antenna arrays that could enable flexible, wearable wireless systems for auto, aviation, and space. (Nanowerk News) Washington State ...

Prototype of a chip-scale RF signal processor with 3D-printed antenna arrays for antenna-in-structure or wearable wireless systems. PULLMAN, Wash. – Washington State University-led researchers have ...

According to Washington State University, researchers have developed a chip-sized processor and 3D printed antenna arrays that could someday lead to flexible and wearable wireless systems and improved ...

Washington State University researchers unveiled 3D-printed antenna arrays with a chip-scale processor, a major breakthrough for flexible wireless systems. This innovation promises lighter, more ...

The original version of this story appeared in Quanta Magazine. If you want to solve a tricky problem, it often helps to get organized. You might, for example, break the problem into pieces and tackle ...

Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...