DISCO’s current main customers are semiconductor and electrical components manufacturers, who manufacture products at their own factories using DISCO equipment and processing tools …

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …

The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method …

Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …

DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。

Jun 2, 2025 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity. When you place the first order with us, please explain application information such as …

DAG811 Surface Grinder Automatic Φ200 mm 1 axis, 1 chuck table

Disaster Information Update Commitment to SBT Certification 2025/11/07 Stock DISCO Dividend Payout for Fiscal Year 2025 2025/10/29 Results Business Forecast Notification 2025/10/29

Jul 9, 2025 · Investors IR News Notice of Revision of Business ForecastNotice of Revision of Business Forecast